型号描述
| 型号 | 生产品牌/企业名称 | 功能参数描述 | LOGO | 操作 |
|---|---|---|---|---|
| 44060 | ETC1List of Unclassifed Manufacturers 未分类制造商 |
PRIMARY VOLTAGE Vacuum filling Two compartments bobbins |  |
|
| 4406A | AOSMDAlpha & Omega Semiconductors 万国半导体美国万国半导体 |
30V N-Channel MOSFET |  |
|
| 44067-1601 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) |  |
|
| 44067-1202 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) Thick PCB | |
|
| 44067-2201 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) | |
|
| 44067-2402 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) Thick PCB 24 Circuits 0.38關m (15關) Gold (Au) Selective Plating | |
|
| 44067-0801 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) | |
|
| 44067-0602 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header Dual Row Vertical for up to 3.56mm | |
|
| 44067-1801 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) Thick PCB 18 Circuits Tin (Sn) Plating | |
|
| 44067-0601 | MOLEX6Molex Electronics Ltd. Molex Electronics Ltd. |
3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header Dual Row Vertical for up to 3.56mm (.140) Thick PCB 6 Circuits Tin (Sn) Plating | |
型号货源
