型号描述
| 型号 | 生产品牌/企业名称 | 功能参数描述 | LOGO | 操作 |
|---|---|---|---|---|
| HSeCaAdS-0440-08C | ASIAdvanced Semiconductor Inc Advanced Semiconductor, Inc |
Excellent Thermal Stability |  |
|
| HSE18-G4A1BI | SICKSICK SICK |
Hybrid photoelectric sensor |  |
|
| HS1-201HSEH-Q | IntersilIntersil Corporation 瑞萨电子瑞萨电子株式会社 |
Radiation Hardened High Speed Quad SPST CMOS Analog Switch |  |
|
| HSE-B1711-057 | CUIDCUI Inc. CUI Inc. |
HEAT SINK |  |
|
| HSE-B1711-032 | CUIDCUI Inc. CUI Inc. |
HEAT SINK | |
|
| HSE-B2111-038 | CUIDCUI Devices CUI Devices |
HEAT SINK HEAT SINK EXTRUSION TO-220 25 | |
|
| HS9-201HSEH-Q | IntersilIntersil Corporation 瑞萨电子瑞萨电子株式会社 |
Radiation Hardened High Speed Quad SPST CMOS Analog Switch | |
|
| HSE-B18318-0396H | CUICUI Inc. CUI Inc. |
HEAT SINK |  |
|
| HSE-B18317-035H-01 | CUICUI Inc. CUI Inc. |
HEAT SINK | |
|
| HSE-B18317-035H | CUICUI Inc. CUI Inc. |
HEAT SINK | |
型号货源
| 型号 | 品牌 | 封装 | 批号 | 库存数量 | 备注 | 供应商 | 询价 |
|---|---|---|---|---|---|---|---|
| 28500 | 原装 | 深圳市永信微电子有限公司 |
  |