型号描述
| 型号 | 生产品牌/企业名称 | 功能参数描述 | LOGO | 操作 |
|---|---|---|---|---|
| TSSOP-38-EP | GMTGlobal Mixed-mode Technology 致新科技致新科技 |
Package Outline | |
|
| TSSOP-28 | GMTGlobal Mixed-mode Technology 致新科技致新科技 |
Package Outline | |
|
| TSSOP-28-EP | GMTGlobal Mixed-mode Technology 致新科技致新科技 |
Package Outline | |
|
| TSSOP-8 | ELM-TECHELM Technology Corporation 榆木科技榆木科技股份公司 |
Package Reel Taping | |
|
| TSSOP16 | nxpNXP Semiconductors 恩智浦恩智浦半导体公司 |
Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt weak pull-up and Agile I/O | |
|
| TSSOP-20 | DIODESDiodes Incorporated 达尔科技达尔科技 |
SUGGESTED PAD LAYOUT | |
|
| TSSOP20-B | TONTEKTONTEK 通泰通泰積體電路股份有限公司 |
Preliminary | |
|
| TSSOP-14-EP | GMTGlobal Mixed-mode Technology 致新科技致新科技 |
Package Outline | |
|
| TSSOP14 | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体 |
14-LEAD THIN SHRINK SMALL OUTLINE | |
|
| TSSOP-8 | IRFInternational Rectifier 英飞凌英飞凌科技公司 |
Ultra Low On-Resistance | |
型号货源
