型号描述
| 型号 | 生产品牌/企业名称 | 功能参数描述 | LOGO | 操作 |
|---|---|---|---|---|
| MS-108-3 | DBLECTRODB Lectro Inc DB Lectro Inc |
Reed Sensor ??pitch 20.32 mm |  |
|
| MS-110262 | AMPHENOLAmphenol Corporation Amphenol Corporation |
the interchangeability and operating characteristics are determined by U.S. Military Specifications. |  |
|
| MS-106433 | AMPHENOLAmphenol Corporation Amphenol Corporation |
the interchangeability and operating characteristics are determined by U.S. Military Specifications. | |
|
| MS-104-3 | DBLECTRODB Lectro Inc DB Lectro Inc |
Micro Reed Sensor ??pitch 11.40 mm | |
|
| MS-112067 | AMPHENOLAmphenol Corporation Amphenol Corporation |
the interchangeability and operating characteristics are determined by U.S. Military Specifications. | |
|
| MS-108-4 | DBLECTRODB Lectro Inc DB Lectro Inc |
Form C Reed Sensor ??pitch 20.32 mm | |
|
| MS-108384 | AMPHENOLAmphenol Corporation Amphenol Corporation |
the interchangeability and operating characteristics are determined by U.S. Military Specifications. | |
|
| MS-108387 | AMPHENOLAmphenol Corporation Amphenol Corporation |
the interchangeability and operating characteristics are determined by U.S. Military Specifications. | |
|
| MS-13-140-Y | etc2List of Unclassifed Manufacturers 未分类制造商 |
High-Speed Interconnect Technology |  |
|
| MS-11-140-Y | etc2List of Unclassifed Manufacturers 未分类制造商 |
High-Speed Interconnect Technology | |
型号货源
